Direct-to-Chip Cooling
选择理想的散热解决方案
芯片直冷散热是前沿的数据中心热管理方法，其冷却机制直接作用于处理器和其他硬件的发热组件。
通过使冷却元件更加接近热源，诸如液冷或微流体系统等芯片直冷散热解决方案，可提高散热效率，并实现更精确的温度控制。这一创新散热方法不仅能提高服务器的整体性能和可靠性，还可让数据中心以更高的功率密度运行。
在优化能源效率、降低散热成本和充分提升给定空间内的计算能力方面，芯片直冷散热技术发挥着至关重要的作用。随着数据中心的持续演进，芯片直冷散热已成为实现可持续高性能计算基础设施的关键解决方案。
Benefits of Direct-to-Chip Cooling in Data Centres
Liquid cooling through Coolant Distribution Units (CDUs) has revolutionized cooling performance in data centers, offering unparalleled efficiency and enhanced thermal management capabilities.
By utilizing liquid as a cooling medium, CDUs facilitate the transfer of heat more effectively than traditional air cooling methods, allowing for greater heat dissipation and improved temperature regulation.
This advanced cooling technology not only optimizes the thermal management of servers and equipment but also enables data centers to operate at higher power densities without compromising performance or reliability.
To fully realize the benefits of direct-to-chip cooling, advanced infrastructure is required. Coolant Distribution Units (CDUs) are the workhorses of this ecosystem. They safely and precisely isolate the facility water loop from the IT equipment cooling loop, ensuring that the massive heat loads generated by clusters of NVIDIA GB300s or AMD Helios chips are efficiently rejected without compromising the safety of the server racks.
We recommend establishing direct-to-chip cooling as a core data centre strategy. The advantages of deploying this technology extend far beyond simply managing temperatures:
- Enabling technologies such as CDUs and liquid cooling support the operation of incredibly high-density racks.
- The strategy significantly improves overall data centre energy efficiency.
- Liquid loops enhance hardware reliability by maintaining consistent operating temperatures.
- This cooling method is critical for enabling intensive AI and HPC workloads.
芯片直冷创新技术重塑散热过程
Direct-to-chip cooling offers a host of benefits that significantly enhance the thermal management and efficiency of data centers. By delivering cooling directly to heat-generating components at the chip level, this innovative approach maximizes heat dissipation efficiency and enables precise temperature control, resulting in improved performance and reliability of servers and hardware.
Direct-to-chip cooling systems also facilitate higher power densities, allowing data centers to operate at increased computational capacities within the same physical footprint. Additionally, this method reduces cooling energy consumption, lowers operational costs, and enhances the overall sustainability of data center operations.
By harnessing the advantages of direct-to-chip cooling, data centers can achieve superior thermal management, optimize energy efficiency, and bolster the performance and longevity of their infrastructure.
Direct-to-chip innovation relies on custom-engineered cold plates that physically attach to the hottest components of your server—the CPU and GPU dies. For systems like the NVIDIA GB200 NVL72, where dozens of GPUs operate in a tightly integrated architecture, micro-channel cold plates capture heat instantaneously at the source. This targeted approach dramatically reduces the need for power-hungry server fans and oversized computer room air conditioning (CRAC) units.
Coolant Distribution Units (CDUs) for Direct-to-Chip Cooling
The precision control and efficiency of liquid cooling systems through CDUs have significantly contributed to reducing energy consumption, minimizing carbon footprint, and maximizing the overall cooling performance of modern data centers, making them a cornerstone of sustainable and high-performance computing infrastructures.
To establish the proper product category, it is vital to understand the systems that drive the fluid through the cold plates. The CDU is the heart of any direct-to-chip liquid cooling deployment, managing flow rates, pressure, and coolant temperatures to ensure optimal thermal transfer from high-wattage silicon
Future of Coolant distribution units & Direct to chip 1MW rack incoming!
RackChiller CDU800 Coolant Distribution Unit
特点
- 冗余高性能无泄漏泵系统
集成变频驱动 - 冷却液连接可通过顶部或底部面板实现
- 集成 10 英寸触控面板显示屏。
- 通过以太网、SNMP v3 和 Modbus 实现远程控制功能
- 板载集成泄漏检测
- 出色的功率密度 – 适配标准数据中心的空间布局
- 支持运行中维护 — 系统维护期间无需停机。
- 冗余系统布局将单点故障风险降至最低。
- 与 nVent 卫士系列管理网关和传感器产品组合集成。
规格
一般数据
- 在 6K（主回路流量为 850 LPM）的条件下，冷却能力达 800+kW。
- 管道连接：3 英寸内径卫生级三夹钳
液体温度范围：20 - 70℃ (68 - 158℉)
主回路额定值
- 冷却液：经过处理的水，含最多 20% 的丙二醇 (PG)
- 最大允许流量：1200 LPM (317 GPM) •
- 最大水头损失（850 LPM 时，水）：1.3 Bar (19 psi)
- 最大系统压力：10.3 Bar (150 psi)
- 系统容积：50 L（13 加仑）
主回路过滤器尺寸：250 微米
二级回路性能
- 冷却液：经过处理的水，含最多 30% 的丙二醇 (PG)
- 最大流量（单泵）：2.6 bar (38 psi) 时高达 1100 LPM (290 GPM)
- 最大流量（双泵）：3.4 bar (49 psi) 时高达 1100 LPM (290 GPM)
- 最大允许静压：3.5 Bar (50psi)
- 最大系统压力：8.6 Bar (125 psi)
- 泄压阀启动压力：9.0 Bar (130 psi)
- 系统容积：100 L（26 加仑）
- 二级回路过滤器尺寸：50 微米
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